The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Jan. 30, 2007
Applicants:
Kenji Uchida, Kawasaki, JP;
Koki Hirasawa, Kawasaki, JP;
Katsumi Shimada, Ibaraki, JP;
Shinjiro Uenishi, Ibaraki, JP;
Shinya Ota, Ibaraki, JP;
Inventors:
Kenji Uchida, Kawasaki, JP;
Koki Hirasawa, Kawasaki, JP;
Katsumi Shimada, Ibaraki, JP;
Shinjiro Uenishi, Ibaraki, JP;
Shinya Ota, Ibaraki, JP;
Assignees:
Nitto Denko Corporation, Osaka, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: