The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7880180 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2011

Filed:

Jun. 11, 2007
Applicants:

Yasuhiro Tada, Tokyo, JP;

Akihiko Hanya, Tokyo, JP;

Inventors:

Yasuhiro Tada, Tokyo, JP;

Akihiko Hanya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosed subject matter provides a composite semiconductor device which can include a common substrate, a first semiconductor light emitting structure, and a second semiconductor light emitting structure. The first semiconductor light emitting structure can include an epitaxial grown layer containing a light emitting layer formed on part of the common substrate either directly or via a bonding layer. The second semiconductor light emitting structure can be provided in a notch at at least one location to which the epitaxial grown layer is not bonded, or in a recess formed in the notch at one location. The disclosed subject matter also provides a method of manufacturing a composite semiconductor device having the above-described and other structures.


Find Patent Forward Citations

Tada, Yasuhiro. (2011). Composite semiconductor device and method of manufacturing the same (U.S. Patent No. 7880180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7880180

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