The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2011

Filed:

Jan. 04, 2007
Applicants:

Yuan-chieh Cheng, Hsinchu, TW;

Kuo-cheng Huang, Hsinchu, TW;

Hui-hsiung Lin, Hsinchu, TW;

Wen-hong Wu, Hsinchu, TW;

Inventors:

Yuan-Chieh Cheng, Hsinchu, TW;

Kuo-Cheng Huang, Hsinchu, TW;

Hui-Hsiung Lin, Hsinchu, TW;

Wen-Hong Wu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for cutting a nonmetal material is provided. The method includes steps of (a) generating a tension stress on a surface of the nonmetal material by exerting a bending stress thereon; (b) providing a thermal effect along a path direction on the surface, wherein the thermal effect grows along a direction opposite to the path direction; (c) providing a first cryogenic effect in a first incident direction along the path direction; and (d) providing a second cryogenic effect in a second incident direction along the path direction, wherein a crack along the path direction on the surface is formed as a result of the tension stress, the thermal effect, and the cryogenic effects therealong for cutting the nonmetal material.


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