The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Dec. 27, 2006
Applicants:
Nobuaki Miyamoto, Hitachi, JP;
Akira Chinda, Hitachi, JP;
Koki Hirasawa, Kawasaki, JP;
Kenji Uchida, Kawasaki, JP;
Inventors:
Nobuaki Miyamoto, Hitachi, JP;
Akira Chinda, Hitachi, JP;
Koki Hirasawa, Kawasaki, JP;
Kenji Uchida, Kawasaki, JP;
Assignees:
Hitachi Cable, Ltd., Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.