The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7879719 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2011

Filed:

Dec. 14, 2008
Applicant:

Eun-soo Jeong, Eumsaong-gun, KR;

Inventor:

Eun-Soo Jeong, Eumsaong-gun, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device and a method for manufacturing the device that minimizes a line width while maximizing integration density of the semiconductor device. The method includes forming an interlayer insulating film on a semiconductor substrate, and then forming a first via hole in the interlayer insulating film, and then forming a resin material in the first via hole, and then forming a plurality of second via holes in the interlayer insulating film laterally, and then forming a resin material in the second via holes, and then simultaneously forming a plurality of third via holes in the interlayer insulating film and a trench spatially above and corresponding to the first via hole, and then removing the resin formed in the first via hole and the second via holes, and then simultaneously forming metal layers in the first via hole and the second and third via holes and the trench.


Find Patent Forward Citations

Jeong, Eun-Soo. (2011). Interconnect structure and method of manufacturing the same (U.S. Patent No. 7879719). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7879719

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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