The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Mar. 16, 2007
Steven P. Barkyoumb, Essex Junction, VT (US);
Jonathan D. Chapple-sokol, Essex Junction, VT (US);
Edward C. Cooney, Iii, Jericho, VT (US);
Keith E. Downes, Stowe, VT (US);
Thomas L. Mcdevitt, Underhill, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Steven P. Barkyoumb, Essex Junction, VT (US);
Jonathan D. Chapple-Sokol, Essex Junction, VT (US);
Edward C. Cooney, III, Jericho, VT (US);
Keith E. Downes, Stowe, VT (US);
Thomas L. McDevitt, Underhill, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and structure for reducing the corrosion of the copper seed layer during the fabrication process of a semiconductor structure. Before the structure (or the wafer containing the structure) exits the vacuum environment of the sputter tool, the structure is warmed up to a temperature above the water condensation temperature of the environment outside the sputter tool. As a result, water vapor would not condense on the structure when the structure exits the sputter tool, and therefore, corrosion of the seed layer by the water vapor is prevented. Alternatively, a protective layer resistant to water vapor can be formed on top of the seed layer before the structure exits the sputter tool environment. In yet another alternative embodiment, the seed layer can comprises a copper alloy (such as with aluminum) which grows a protective layer resistant to water vapor upon exposure to water vapor.