The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Jan. 22, 2009
Applicant:
Kiyonori Watanabe, Tokyo, JP;
Inventor:
Kiyonori Watanabe, Tokyo, JP;
Assignee:
Oki Semiconductor Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provide a semiconductor device manufacturing method, including: preparing a substrate; laminating an insulation layer on the substrate; laminating a first underlying metal layer on the insulation layer; forming rewiring on the first underlying metal layer; removing exposed portions of the first underlying metal layer; laminating a second underlying metal layer on the rewiring and the insulation layer; forming a column electrode on the rewiring via the second underlying metal layer; and removing exposed portions of the second underlying metal layer.