The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Nov. 15, 2004
Naotaka Hanai, Obu, JP;
Tomohiro Sakagami, Obu, JP;
Toshiaki Kakuto, Obu, JP;
Takanori Tanaka, Toyota, JP;
Naotaka Hanai, Obu, JP;
Tomohiro Sakagami, Obu, JP;
Toshiaki Kakuto, Obu, JP;
Takanori Tanaka, Toyota, JP;
Tokai Kogyo Kabushiki Kaisha, Aichi-ken, JP;
Abstract
Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.