The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2011

Filed:

Apr. 27, 2007
Applicant:

Stefan Weber, Wertheim, DE;

Inventor:

Stefan Weber, Wertheim, DE;

Assignee:

Pink GmbH Thermosysteme, Wertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method and device () for the temperature treatment of workpieces () or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber () which is sealed from the surrounding area, wherein the heating and the cooling of the component () are carried out in two chamber regions () of the process chamber (), which can be separated from one another by means of a condensation device ().


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