The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Oct. 30, 2007
Ananda H. Kumar, Fremont, CA (US);
Ezekiel J. J. Kruglick, San Diego, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Kieun Kim, Pasadena, CA (US);
Gang Zhang, Monterey Park, CA (US);
Richard T. Chen, Burbank, CA (US);
Christopher A. Bang, San Diego, CA (US);
Vacit Arat, La Canada Flintridge, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Uri Frodis, Los Angeles, CA (US);
Pavel B. Lembrikov, Santa Monica, CA (US);
Jeffrey A. Thompson, Los Angeles, CA (US);
Ananda H. Kumar, Fremont, CA (US);
Ezekiel J. J. Kruglick, San Diego, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Kieun Kim, Pasadena, CA (US);
Gang Zhang, Monterey Park, CA (US);
Richard T. Chen, Burbank, CA (US);
Christopher A. Bang, San Diego, CA (US);
Vacit Arat, La Canada Flintridge, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Uri Frodis, Los Angeles, CA (US);
Pavel B. Lembrikov, Santa Monica, CA (US);
Jeffrey A. Thompson, Los Angeles, CA (US);
Microfabrica Inc., Van Nuys, CA (US);
Abstract
Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.