The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2011

Filed:

Feb. 16, 2009
Applicant:

Hung-shern Tsai, Tainan County, TW;

Inventor:

Hung-Shern Tsai, Tainan County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a semiconductor structure. A first type body doped region is deposited on a first type substrate. A first type heavily-doped region having a finger portion with an enlarged end region is deposited on the first type body doped region. A second type well region is deposited on the first type substrate. A second type heavily-doped region is deposited on the second type well region. An isolation structure is deposited between the first type heavily-doped region and the second type heavily-doped region. A gate structure is deposited on the first type substrate between the first type heavily-doped region and the isolation structure.


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Tsai, Hung-Shern. (2011). Semiconductor structure having an enlarged finger shaped region for reducing electric field density and method of manufacturing the same (U.S. Patent No. 7875930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7875930

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