The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2011

Filed:

Dec. 07, 2007
Applicants:

Kazuya Nozu, Aichi, JP;

Toshihisa Nomura, Aichi, JP;

Inventors:

Kazuya Nozu, Aichi, JP;

Toshihisa Nomura, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component-inspection wiring board including a first laminate composed of plural first ceramic layers and having pads formed on a front surface to transmit inspection signals to an electronic component, wiring layers formed between the first ceramic layers , and via-conductors connecting pads to the wiring layers exposed on a rear surface of the first laminate; and a second laminate composed of second ceramic layers having plural via-conductors extending between front surface and rear surface of the second laminate, wherein lands connecting a via-conductor exposed on the rear surface of the first laminate and a via-conductor exposed on the front surface of the second laminate are disposed between the first laminate and the second laminate, and the diameter dof the land is 2-5 times larger than the diameter dof a via-conductor connected to the land.


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