The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Nov. 19, 2007
Tsing-chow Wang, Shanghai, CN;
Tsing-Chow Wang, Shanghai, CN;
Abstract
The present invention provides a multi-die semiconductor package structure and a manufacturing method thereof, which includes providing at least two dies and a lead frame including a die pad and a lead wire located at the periphery of the die pad, the die pad has a via hole at the edge thereof, binding a base opposite side of a first die to the die pad; electrically connecting the first die to the lead wire through the via hole; binding a base side of a second die to the die pad, the first and second dies are disposed on the opposite sides of the die pad respectively; electrically connecting the second die to the lead wire; stacking other dies above the first or second die and electrically connecting them to the lead wire; and encapsulating said at least two dies and the lead frame to form a package.