The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Jun. 16, 2009
Applicant:
Yoshiharu Kaneda, Shiga, JP;
Inventor:
Yoshiharu Kaneda, Shiga, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/50 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A structure to be plated includes a body to be platedon which plating is formed, and plated film thickness determining memberopposed to and electrically isolated from the body to be platedthrough a slit portion. The plated film thickness determining memberhas an islands-shape and is conductive. It is possible to instantly determine whether or not the plating formed on the body to be platedhas been formed to a thickness larger than the width W of the slit portionon the spot by determining whether or not plating has grown from the surface of the body to be platedto the plated film thickness determining memberthrough the slit portion