The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2011

Filed:

Jan. 22, 2009
Applicants:

Samuel Kim, Austin, TX (US);

Ehsan Saeedi, Seattle, WA (US);

Babak Amirparviz, Seattle, WA (US);

Inventors:

Samuel Kim, Austin, TX (US);

Ehsan Saeedi, Seattle, WA (US);

Babak Amirparviz, Seattle, WA (US);

Assignee:

University of Washington, Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites.


Find Patent Forward Citations

Loading…