The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Jun. 11, 2008
Siew S. Hiew, San Jose, CA (US);
Frank I-kang Yu, Palo Alto, CA (US);
Nan Nan, San Jose, CA (US);
Paul Hsueh, Concord, CA (US);
Abraham C. MA, Fremont, CA (US);
Ming-shiang Shen, Taipei, TW;
Siew S. Hiew, San Jose, CA (US);
Frank I-Kang Yu, Palo Alto, CA (US);
Nan Nan, San Jose, CA (US);
Paul Hsueh, Concord, CA (US);
Abraham C. Ma, Fremont, CA (US);
Ming-Shiang Shen, Taipei, TW;
Super Talent Electronics, Inc., San Jose, CA (US);
Abstract
According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.