The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Apr. 10, 2007
Chang-woo Koo, Seoul, KR;
Jin-sook Lee, Suwon-si, KR;
Do-hyung Kim, Yongin-si, KR;
Hyun-jung Yoo, Suwon-si, KR;
Chang-Woo Koo, Seoul, KR;
Jin-Sook Lee, Suwon-si, KR;
Do-Hyung Kim, Yongin-si, KR;
Hyun-Jung Yoo, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile