The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Jan. 09, 2008
Hitoshi Shindo, San Jose, CA (US);
Teruhiro Nakamiya, Kanagawa, JP;
Kouki Uefume, Kanagawa, JP;
Takako Hayakawa, Kanagawa, JP;
Hitoshi Shindo, San Jose, CA (US);
Teruhiro Nakamiya, Kanagawa, JP;
Kouki Uefume, Kanagawa, JP;
Takako Hayakawa, Kanagawa, JP;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.