The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Aug. 07, 2007
Noboru Yamanaka, Tokyo, JP;
Soji Koide, Tokyo, JP;
Yoshiyuki Mizoguchi, Tokyo, JP;
Eric Cheuk Wing Leung, Hong Kong, CN;
Chris Chiu Ming Leung, Hong Kong, CN;
Leo Wai Kay Lau, Hong Kong, CN;
Charles Kin Chiu Wong, Hong Kong, CN;
Noboru Yamanaka, Tokyo, JP;
Soji Koide, Tokyo, JP;
Yoshiyuki Mizoguchi, Tokyo, JP;
Eric Cheuk Wing Leung, Hong Kong, CN;
Chris Chiu Ming Leung, Hong Kong, CN;
Leo Wai Kay Lau, Hong Kong, CN;
Charles Kin Chiu Wong, Hong Kong, CN;
TDK Corporation, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
Provided is a method for testing a head element that enables proper evaluation of the head element based on a characteristic of the head element under high-temperature and high-stress conditions. The testing method can be performed on a thin-film magnetic head including a head element and a heating element capable of applying a heat and stress to the head element, or performed on a row bar or a substrate wafer on which a plurality of the head elements and a plurality of the heating elements are disposed. The testing method comprises the steps of: causing the heating element to generate heat to apply a heat and stress to the head element; and measuring a characteristic of the head element under the heat and stress to evaluate the head element.