The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Mar. 14, 2006
Yoshiyuki Hojo, Kyoto, JP;
Hirotaka Nakabayashi, Kyoto, JP;
Yoshiyuki Hojo, Kyoto, JP;
Hirotaka Nakabayashi, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A semiconductor integrated circuit device (IC) comprises a semiconductor chip (CHIP), a first frame lead (FR), and a second frame lead (FR). The semiconductor chip (CHIP) includes common-base transistors (P, P), pads (T, T) connected to the respective emitters of the common-base transistors (P, P), pads (T, T) connected to the respective collectors of the common-base transistors (P, P), and a means (DRV, ERR, E) for generating a base signal. The pads (T, T) are connected through the respective bonding wires (W, W) to the first frame lead (FR). The pads (T, T) are connected through the respective bonding wires (W, W) to the second frame lead (FR). This structure can easily detect breaking of the bonding wires connected in parallel.