The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2011

Filed:

May. 01, 2007
Applicants:

Su Yeol Lee, Gyeonggi-Do, KR;

Bang Won OH, Gyeonggi-Do, KR;

Doo Go Baik, Gyeonggi-Do, KR;

Tae Sung Jang, Gyeonggi-Do, KR;

Jong Gun Woo, Gyeonggi-Do, KR;

Seok Beom Choi, Daejeon, KR;

Sang Ho Yoon, Gyeonggi-Do, KR;

Dong Woo Kim, Seoul, KR;

IN Tae Yeo, Seoul, KR;

Inventors:

Su Yeol Lee, Gyeonggi-Do, KR;

Bang Won Oh, Gyeonggi-Do, KR;

Doo Go Baik, Gyeonggi-Do, KR;

Tae Sung Jang, Gyeonggi-Do, KR;

Jong Gun Woo, Gyeonggi-Do, KR;

Seok Beom Choi, Daejeon, KR;

Sang Ho Yoon, Gyeonggi-Do, KR;

Dong Woo Kim, Seoul, KR;

In Tae Yeo, Seoul, KR;

Assignee:

Samsung LED Co., Ltd., Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portions of the metal seed layer and the second plated layer between the light emission structures.


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