The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
May. 31, 2006
Joji Fujimori, Kawasaki, JP;
Joji Fujimori, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
To provide a low-cost, easy-to-use, and efficient method for manufacturing a semiconductor device, which eliminates the need for the formation or removal of barrier metals upon formation of bumps, and a high-performance semiconductor device with fine bumps arranged at a narrow pitch. The method includes: forming a plurality of electrode padson one surface of a semiconductor substrate; forming insulating layers (e.g., inorganic insulating layerand organic insulating layer) to cover the perimeter of each electrode pad; selectively forming a mask layeron the insulating layersand; cleaning the surface of the electrode padswhich is not covered with the insulating layersand; forming external terminalsin regions defined by the insulating layersandand mask layerso that they are in contact with the electrode pads; and removing the mask layer