The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7871835 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 18, 2011

Filed:

Apr. 03, 2009
Applicants:

Shu-ling Yeh, Yangmei Township, TW;

Ya-lan Chuang, Lioujia Township, TW;

Pei-jung Tsai, Cingshuei Township, TW;

Chih-hsiang Lin, Taipei, TW;

Hsin-ching Kao, Baoshan Township, TW;

Feng-chih Chang, Hsinchu, TW;

Tang-jung Wu, Dali, TW;

Inventors:

Shu-Ling Yeh, Yangmei Township, TW;

Ya-Lan Chuang, Lioujia Township, TW;

Pei-Jung Tsai, Cingshuei Township, TW;

Chih-Hsiang Lin, Taipei, TW;

Hsin-Ching Kao, Baoshan Township, TW;

Feng-Chih Chang, Hsinchu, TW;

Tang-Jung Wu, Dali, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/469 (2006.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.


Find Patent Forward Citations

Yeh, Shu-Ling. (2011). Method for packaging light-emitting diode (U.S. Patent No. 7871835). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7871835

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