The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Jan. 28, 2009
Mitsuhiko Ogihara, Tokyo, JP;
Hiroyuki Fujiwara, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Mitsuhiko Ogihara, Tokyo, JP;
Hiroyuki Fujiwara, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Oki Data Corporation, Tokyo, JP;
Abstract
A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.