The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Jul. 11, 2008
Yasushi Masago, Shimonoseki, JP;
Ryoichi Ozaki, Shimonoseki, JP;
Hiroshi Sakamoto, Shimonoseki, JP;
Yukio Sugishita, Shimonoseki, JP;
Yasushi Masago, Shimonoseki, JP;
Ryoichi Ozaki, Shimonoseki, JP;
Hiroshi Sakamoto, Shimonoseki, JP;
Yukio Sugishita, Shimonoseki, JP;
Kobe Steel, Ltd., Kobe-shi, JP;
Abstract
Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [Dof the minimum inscribed circle of the Sn covering layer is 0.2 μm or less, the diameter [Dof the maximum inscribed circle of the Sn covering layer is 1.2 to 20 μm, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 μm or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 μm or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.