The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Dec. 03, 2007
Eiichi Murakoshi, Osaka, JP;
Hideki Sato, Chiba, JP;
Hideki Sagano, Kawasaki, JP;
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Abstract
A semiconductor package socket () has a socket base () including a package rest () on which a semiconductor package () having gull-wing leads () is put, a cover member () movably attached on the socket base, and a plurality of contacts () each including a first contact piece () capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece () capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile