The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2011

Filed:

Nov. 22, 2004
Applicants:

Hiroshi Kubo, Tokyo, JP;

Katsumi Kojima, Tokyo, JP;

Yasuhide Oshima, Tokyo, JP;

Yoshihiko Yasue, Tokyo, JP;

Hiroki Iwasa, Tokyo, JP;

Inventors:

Hiroshi Kubo, Tokyo, JP;

Katsumi Kojima, Tokyo, JP;

Yasuhide Oshima, Tokyo, JP;

Yoshihiko Yasue, Tokyo, JP;

Hiroki Iwasa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 51/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

The mold apparatus has a pair of upper and lower molds being used for forming a score on one side surface of an easy-opening can end fabricated by a laminated metal sheet. The upper mold has a convex part for forming the score, and the cross sectional shape of the convex part at the portion contacting the laminated metal sheet is composed of a curve having a change rate of inclination of 0.08 or smaller to the upper surface of the facing lower mold, or having the curve and a straight line. The formed score has a maximum width of 0.80 mm or smaller.


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