The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Sep. 06, 2007
Kazuo Okamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Takeshi Morita, Fukuoka, JP;
Masanori Hiyoshi, Fukuoka, JP;
Kazuhiko Tomoyasu, Fukuoka, JP;
Kazuo Okamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Takeshi Morita, Fukuoka, JP;
Masanori Hiyoshi, Fukuoka, JP;
Kazuhiko Tomoyasu, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile