The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Jan. 17, 2008
Applicants:

Thomas F. Knight, Belmont, MA (US);

David B. Salzman, New York, NY (US);

Inventors:

Thomas F. Knight, Belmont, MA (US);

David B. Salzman, New York, NY (US);

Assignee:

Oracle America, Inc., Redwood Shores, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/06 (2006.01); H05K 7/08 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/reparability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.


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