The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Mar. 03, 2009
James Jen-ho Wang, Phoenix, AZ (US);
Carl E. D'acosta, Mesa, AZ (US);
Justin E. Poarch, Gilbert, AZ (US);
James Jen-Ho Wang, Phoenix, AZ (US);
Carl E. D'Acosta, Mesa, AZ (US);
Justin E. Poarch, Gilbert, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A stacked semiconductor device assembly () includes a device () having conductive traces () formed therein, and conductive interconnects () electrically connected to the conductive traces (). Another device () has conductive traces () formed therein and device pads () formed on an outer surface () of the device (). A method () entails attaching () a magnetic core () to an outer surface () of the device () and forming () the conductive interconnects () on the outer surface () using a stud bumping technique such that the interconnects () surround the magnetic core (). The conductive interconnects () are coupled () with the device pads () using thermocompression bonding to couple the device () with the device () to form a continuous device coil () wrapped around the magnetic core () from an alternating electrical connection of the traces (), the conductive interconnects (), and the traces ().