The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Feb. 17, 2010
Applicants:

Toshiaki Konno, Miyagi-ken, JP;

Naoki Kitaura, Miyagi-ken, JP;

Nobuaki Haga, Miyagi-ken, JP;

Inventors:

Toshiaki Konno, Miyagi-ken, JP;

Naoki Kitaura, Miyagi-ken, JP;

Nobuaki Haga, Miyagi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/14 (2006.01); G01R 33/05 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.


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