The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Jan. 29, 2010
Nobuhira Tanaka, Yasu, JP;
Hisashi Yamazaki, Kanazawa, JP;
Nobuhira Tanaka, Yasu, JP;
Hisashi Yamazaki, Kanazawa, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An elastic wave device has a structure that prevents cracks from being formed in a piezoelectric substrate in flip-chip bonding using a bump, that minimizes the contact resistance in a contact portion where wiring patterns are electrically connected to each other, and that improves the insertion loss. In the elastic wave device, first and second multilayer electrically conductive films are provided on a piezoelectric substrate, the first multilayer electrically conductive film defines an IDT electrode and a first wiring pattern, the second multilayer electrically conductive film defines an electrode pad to which a bump is connected and a second wiring pattern, at least one contact portion where the second wiring pattern is overlapped on the first wiring pattern so as to be electrically connected to each other is provided, a top electrically conductive film of the first multilayer electrically conductive film is a Ti film, and a bottom electrically conductive film of the second multilayer electrically conductive film is an Al-based electrically conductive film including Al or an alloy mainly containing an Al.