The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
May. 30, 2006
Shuichi Muramatsu, Numazu, JP;
Hidetoshi Suzuki, Numazu, JP;
Tomoyuki Sato, Numazu, JP;
Kazuo Hara, Numazu, JP;
Shuichi Muramatsu, Numazu, JP;
Hidetoshi Suzuki, Numazu, JP;
Tomoyuki Sato, Numazu, JP;
Kazuo Hara, Numazu, JP;
Kokusan Denki Co. Ltd., Shizuoka, JP;
Abstract
A resin sealing semiconductor device () having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (and) molded into a generally plate shape, and outer lead portions of the plurality of leads (and) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (toandto) of each chip mounting board are placed on one surfaces of the resin molded portions (and), wherein a plurality of positioning protrusions () are provided on one surfaces of the resin molded portions (and), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mounting board and a radiator plate when the positioning protrusions () are abutted against the radiator plate.