The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
May. 25, 2009
Applicants:
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Inventors:
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate includes a substrate layer and a circuit film formed over the substrate layer. One or more openings are formed in the circuit film and the substrate layer. Conductive plates are formed over the circuit film at the peripheries of the openings. A semiconductor die is attached to the circuit film, below the openings with an adhesive material. A conductive material is disposed in the openings to electrically connect the semiconductor die to the conductive plates.