The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Feb. 21, 2008
Applicant:
Takao Sasaki, Kawasaki, JP;
Inventor:
Takao Sasaki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor integrated circuit which is connected to a substrate by solder bumps wherein, when at least one solder bump is connected to a signal line of the semiconductor integrated circuit and the semiconductor integrated circuit is mounted on the substrate, the semiconductor integrated circuit is bonded to the substrate by the solder bump, and the interconnection to the substrate is made by dummy bumps forming wires at the substrate side.