The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Jun. 20, 2008
Ching-chuan Shiue, Taoyuan Hsien, TW;
Shih-peng Chen, Taoyuan Hsien, TW;
Chao-min Chen, Taoyuan Hsien, TW;
Huang-kun Chen, Taoyuan Hsien, TW;
Ching-Chuan Shiue, Taoyuan Hsien, TW;
Shih-Peng Chen, Taoyuan Hsien, TW;
Chao-Min Chen, Taoyuan Hsien, TW;
Huang-Kun Chen, Taoyuan Hsien, TW;
Delta Electronics Inc., Taoyuan Hsien, TW;
Abstract
A manufacturing method of a light emitting diode (LED) apparatus includes the steps of: forming at least one temporary substrate, which is made by a curable material, on a LED device; and forming at least a thermal-conductive substrate on the LED device. The manufacturing method does not need the step of adhering the semiconductor structure onto another substrate by using an adhering layer, and can make the devices to be in sequence separated after removing the temporary substrate, thereby obtaining several LED apparatuses. As a result, the problem of current leakage due to the cutting procedure can be prevented so as to reduce the production cost and increase the production yield.