The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Mar. 05, 2010
Applicants:

Mitsuyuki Kimura, Kyoto, JP;

Kaoru Yamashita, Kyoto, JP;

Hiroto Yamashita, Kyoto, JP;

Tomoyuki Futakawa, Kyoto, JP;

Inventors:

Mitsuyuki Kimura, Kyoto, JP;

Kaoru Yamashita, Kyoto, JP;

Hiroto Yamashita, Kyoto, JP;

Tomoyuki Futakawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 33/00 (2010.01); F21V 7/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a baseformed of a glass substrate; a recessformed on a first main surfaceof the base; a through holeextending from a bottom portionof the recess to a second main surfaceof the base; an inner wall conductive film formed on an inner wall surface of the through hole; a wiring patternmade of a conductive film formed around an opening of the through hole on the bottom portion of the recess so as to be connected electrically to the inner wall conductive film; an optical semiconductor elementbonded to the wiring pattern via a conductive bonding material; a terminal portionmade of a conductive film formed around an opening of the through hole on the second main surface such that it is connected electrically to the inner wall conductive film; and a metal portionbonded to the inner wall conductive film to clog the through hole.


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