The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Feb. 11, 2007
Dezheng Wang, Beijing, CN;
Dezheng Wang, Beijing, CN;
Other;
Abstract
An apparatus and method are disclosed for measuring the kinetic parameters of a catalyst powder, which include the reaction rate constants, active site concentration and intraparticle diffusivity. The measurement of the active site concentration selectively measures just the active sites and not the entire exposed atom concentration. The apparatus and method use surface concentrations less than 50% and larger than 1% the total active site concentration and a dynamic pulsed flow to avoid including weak adsorption sites not involved in the catalysis. The measurement is more accurate because (1) it uses a reactant gas and non-steady state adsorption at temperatures near to reaction temperatures, and (2) it uses the chemical kinetics expressions to extract the measured active site concentration to perform the measurement so as to count just those sites actually active for that reactant. This is better than the prior art methods that measure an entire surface atom concentration under non-dynamic conditions because the latter is not necessarily the same as the active site concentration in the chemical kinetics expression. The intraparticle diffusivity measured by the apparatus and method is the effective gas diffusivity in a porous powder, and this is useful as a characterization of the tortuosity of the porous powder.