The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Jun. 19, 2006
Takashi Mori, Tokyo, JP;
Yuji Tsuruoka, Kawasaki, JP;
Masao Furukawa, Yokohama, JP;
Seiichi Kamiya, Yokohama, JP;
Nobuhito Yamaguchi, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Yuji Tsuruoka, Kawasaki, JP;
Masao Furukawa, Yokohama, JP;
Seiichi Kamiya, Yokohama, JP;
Nobuhito Yamaguchi, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A circuit pattern forming method includes a first ejection step of ejecting large droplets of a circuit pattern forming liquid onto a substrate, by causing a liquid ejection head to scan the substrate, to form first dots of the liquid on the substrate with gaps between the first dots, a second ejection step of ejecting, from the liquid ejection head, before the first dots formed on the substrate solidify, and while the liquid ejection head is caused to scan the substrate in the first ejection step, a small droplet, which is smaller in size than the large droplets, to form a second dot of the liquid between the first dots of the liquid on the substrate and, thereby to form a liquid circuit pattern by mixing the first dots and the second dot together, and a fixing step of solidifying the liquid circuit pattern to form a circuit pattern on the substrate.