The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Apr. 28, 2008
Kuo-len Lin, Wugu Township, Taipei County, TW;
Wen-jung Liu, Wugu Township, Taipei County, TW;
Chih-hung Cheng, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Wen-Jung Liu, Wugu Township, Taipei County, TW;
Chih-Hung Cheng, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Golden Sun News Techniques Co., Ltd., Taipei, TW;
CPUMATE Inc., Taipei, TW;
Abstract
A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile