The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Jun. 12, 2007
Applicants:

Masafumi Moriya, Hiratsuka, JP;

Kazuya Ishiwata, Yokosuka, JP;

Yoshio Suzuki, Isehara, JP;

Inventors:

Masafumi Moriya, Hiratsuka, JP;

Kazuya Ishiwata, Yokosuka, JP;

Yoshio Suzuki, Isehara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a wiring board comprising preparing a substrate having a groove and an adjacent area; the substrate being of a wiring board also comprising a first wiring having first and second portions provided in first and second areas, respectively, making a contact angle of the second area different from a contact angle of a third area which is another part of the adjacent area, surrounding the second area together with the groove; and applying conductive paste to at least the first and second areas.


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