The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Mar. 11, 2009
Applicants:
Seiichi Inoue, Kanagawa, JP;
Akira Ichiki, Kanagawa, JP;
Inventors:
Seiichi Inoue, Kanagawa, JP;
Akira Ichiki, Kanagawa, JP;
Assignee:
Fujifilm Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A metallization forming method comprises the steps of: patterning a silver halide emulsion on a surface of at least one side of a substrate in accordance with a desired metallization pattern to form a patterned emulsion layer; exposing the patterned emulsion layer; and thereafter developing the exposed patterned emulsion layer to form a patterned conductive silver layer having the metallization pattern.