The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Apr. 28, 2009
Motoharu Hiroshima, Nomi, JP;
Soichi Nakamura, Omihachiman, JP;
Yasunori Takei, Komatsu, JP;
Hirotsugu Mori, Yasu, JP;
Motoharu Hiroshima, Nomi, JP;
Soichi Nakamura, Omihachiman, JP;
Yasunori Takei, Komatsu, JP;
Hirotsugu Mori, Yasu, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A resonant element is manufactured through a process including a setting step and a forming step. A substrate of the resonant element is made of a dielectric material. A ground electrode is formed on a rear principal surface side of the substrate. Principal-surface electrodes that define resonators together with the ground electrode and the dielectric material are formed on a front principal surface side of the substrate. An electrode protecting layer is formed on substantially entire surfaces on a front principal surface side of the principal-surface electrodes and the substrate. A coupling adjusting electrode with both ends facing a plurality of the principal-surface electrodes is formed on a front principal surface side of the electrode protecting layer. In the setting step, the shape of the coupling adjusting electrode is set in each manufactured lot. In the forming step, the coupling adjusting electrode having the shape set in the setting step in each manufactured lot is formed on the front principal surface side of the substrate and the electrode protecting layer that are sintered in advance, and the coupling adjusting electrode is baked to the electrode protecting layer.