The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

May. 12, 2009
Applicants:

Qin LI, Shenzhen, CN;

Yu-hsu Lin, San Jose, CA (US);

Jeng-da Wu, Taipei Hsien, TW;

Chih-hang Chao, Taipei Hsien, TW;

Inventors:

Qin Li, Shenzhen, CN;

Yu-Hsu Lin, San Jose, CA (US);

Jeng-Da Wu, Taipei Hsien, TW;

Chih-Hang Chao, Taipei Hsien, TW;

Assignees:

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.


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