The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Oct. 19, 2007
James Sheats, Palo Alto, CA (US);
James Sheats, Palo Alto, CA (US);
Other;
Abstract
A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly embedding the chips on the permanent substrate before removing the temporary substrate. With the surface of the chips coplanar with the surface of the complete structure without any gaps, interconnect metal lines can be easily placed on the uninterrupted surface, connecting the chips and other components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile