The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Jul. 22, 2009
Junji Shiota, Hamura, JP;
Taisuke Koroku, Sagamihara, JP;
Nobumitsu Fujii, Ome, JP;
Osamu Kuwabara, Tokyo, JP;
Osamu Okada, Hamura, JP;
Junji Shiota, Hamura, JP;
Taisuke Koroku, Sagamihara, JP;
Nobumitsu Fujii, Ome, JP;
Osamu Kuwabara, Tokyo, JP;
Osamu Okada, Hamura, JP;
Casio Computer Co., Ltd., Tokyo, JP;
Abstract
In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.