The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Dec. 05, 2007
Applicants:
Sung-hwan Yoon, Chungcheongnam-do, KR;
Beung-seuck Song, Gyeonggi-do, KR;
Inventors:
Sung-Hwan Yoon, Chungcheongnam-do, KR;
Beung-Seuck Song, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a stack package and a stack packaging method. The stack package includes: a first package; and a second package stacked on the first package, wherein external leads of the first package and the second package are directly connected to one another and inner leads thereof are arranged in different shapes so that the Chip Select signal of the second package are input through a No Select pin of the first package.