The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Jun. 10, 2005
Applicants:

Byoung-rim Seo, Seoul, KR;

Jae-cheon DO, Chungcheongnam-do, KR;

Yung-cheol Kong, Chungcheongnam-do, KR;

Seok-won Lee, Gyeonggi-do, KR;

Inventors:

Byoung-Rim Seo, Seoul, KR;

Jae-Cheon Do, Chungcheongnam-do, KR;

Yung-Cheol Kong, Chungcheongnam-do, KR;

Seok-Won Lee, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.


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