Resin composition, varnish, resin film and semiconductor device using the same

Abstract

A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), Ris a single bond or has a structure represented by formula (2); Rto Rare respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and 'X' is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), 'Ar' is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; Ris hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of Rto Ris the group having an alicyclic structure when Ris a single bond; at least one of Rto Ris the group having an alicyclic structure when Rhas the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.