The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Nov. 25, 2003
Applicants:

Etsuo Okahara, Ube, JP;

Toshio Arai, Ube, JP;

Kazuaki Kobayashi, Yoshiki-gun, JP;

Takashi Okusako, Ube, JP;

Inventors:

Etsuo Okahara, Ube, JP;

Toshio Arai, Ube, JP;

Kazuaki Kobayashi, Yoshiki-gun, JP;

Takashi Okusako, Ube, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/16 (2006.01); B29C 45/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

An in-mold coating method for molding a molded product with an excellent external appearance. A resin molded product is kept pressed against a mold cavity surface until immediately before coating. Mold-clamping force in a second step in which the shape of the resin molded product is fixed and that in a fourth step are selected so that the deformation of the mold cavity by the mold-clamping forces is substantially the same in the second and fourth steps. Even if the mold cavity deforms by the mold-clamping force in the second step, the mold cavity deforms similarly in the fourth step to provide a uniform coating thickness. Alternatively, a mold-clamping force smaller than that in the first step is selected for the second step to reduce the degree of deformation of the mold cavity and to achieve a uniform coating thickness.


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